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The Nanoscale Fabrication Center (NFC)

The Nanoscale Fabrication Center (NFC) at the University of Wisconsin-Madison provides a research facility for microfabrication technologies, products and innovations. In order to give students a state-of-the-art education and to maintain leading-edge research programs, we continue to improve this advanced laboratory.

NFC maintains a suite of semiconductor and microfabrication processing equipment in a cleanroom laboratory. Access to the lab and to all equipment is available to qualified users from the University of Wisconsin, other education institutions, or industry. WCAM is a cost recovery facility.

The laboratory is located on the third floor of the Engineering Centers Building on the University of Wisconsin-Madison campus. Click here for a searchable UW campus map, or return to the NFC home page for more contact information.

For use, questions or more information, please contact the DIrector of MRSEC facilities:

Dr. Jerry Hunter (jerry.hunter@wisc.edu)

(608) 263-1073

Instrumentation: 
  1. Four-Point Probe
  2. Aligner for EV 801 Bonder
  3. Aluminum Wedge Bonder
  4. Anneal Oven
  5. Anneal Oven
  6. Automegasamdri 915B Critical Point Dryer
  7. Buffered Oxide Etch Chemical Bench
  8. Chemical Bench
  9. Chemical Bench ("DAE Bench")
  10. Chemical bench (Prefurnace Clean)
  11. Chemical bench for teaching
  12. Chemical bench for teaching
  13. Contact Aligner / IR Back Side Aligner
  14. Contact Aligner / IR Back Side Aligner
  15. Contact Aligner, 3" wafers;
  16. Contact Aligners for 4-inch Wafers
  17. DC Sputterer
  18. Dicing Saws
  19. Die Attacher
  20. E-beam Evaporator
  21. E-Beam Evaporator
  22. E-beam Evaporator
  23. Elionix ELS-G100 Electron Beam Lithography System
  24. Fiji G2 Atomic Layer Deposition System
  25. Film Stress Measurement
  26. Filmetrics
  27. Forming Gas Metal Anneal Furnace
  28. Furnace Tube 1
  29. Furnace Tube 3
  30. Furnace Tube 4
  31. Furnace Tube 6
  32. General-Use Steam Oxidation Furnace Tube 2
  33. Gold Ball Bonder
  34. Heidelberg DWL 66+ laser writer lithography system
  35. high-density plasma RIE
  36. III-V Semiconductor Chemical Bench
  37. Indium Evaporator
  38. Lithography Ovens
  39. Low-Temperature Oxide Furnace
  40. Metal Etcher
  41. Non-Litho Spinner
  42. Obducat AB Nano Imprint Lithography system - Nanoimprinter
  43. Optical microscope with Camera and PC
  44. Optical microscope with Camera and PC
  45. Photoresist spincoater for teaching
  46. Piranha Bench
  47. PLA-501 Contact Aligner;
  48. Plasma Asher & Stripper
  49. Plasma Therm Apex SLR ICP plasma etching system
  50. PlasmaTherm
  51. Polysilicon LPCVD Furnace
  52. Probe Station
  53. Programmable Photoresist Spinner #2 - SU8
  54. Programmable Photoresist Spinners #1 and #3 - General Use
  55. Programmable Polymer Oven
  56. Programmable Polymer Oven
  57. Projection Litho Exposure Stepper
  58. Rapid Thermal Annealer
  59. Reactive-Ion Etcher
  60. RF/DC Sputterer
  61. Silicon Deep RIE
  62. Silicon Wet Etch Bench
  63. Solvent Bench
  64. Solvent Benches
  65. Spin-Rinse Dryer
  66. Spin-Rinse Dryer
  67. Spin-Rinse Dryer
  68. Spin-Rinse Dryer (SRD)
  69. SU8 Solvent Bench
  70. Surface Profilometer (2 units)
  71. Thermal Anneal Furnace for Metals ("Aluminum Anneal Tube")
  72. Unaxis 790 RIE
  73. UV-Ozone Stripper/Cleaner
  74. Wafer Bonder
  75. Wafer Scribe
  76. Wet/Dry Oxidation Furnace
  77. Wet/Dry Oxidation Furnace for teaching
  78. Wet/Dry Oxidation Furnace for teaching
  79. Wet/Dry Oxidation Furnace for teaching
  80. Wet/Dry Oxidation Tube, Classroom Bay